Evaluating Performance of IC Packaging and Testing Firms by Bootstrap Data Envelopment Analysis
Erwin T. J. Lin *
Department of Marketing and Logistics, MingDao University, Taiwan.
*Author to whom correspondence should be addressed.
Abstract
Taiwan’s Integrated Circuit Packaging and Testing (ICPT) industry ranks number one in the world with 56% market share. However, facing the keen competition from global market, enhancing the operating performance becomes the most important way to be survival. As such measuring the efficiency deserves in-depth investigation. This paper adopts DEA and Bootstrap DEA methods to evaluate the performance for 24 global ICPT companies in 2010. The results show that, the average bias-corrected efficiency is slightly less than DEA efficiency. Based on the results some conclusions are drawn and recommendations for improving performance as well as the future study are proposed.
Keywords: Data Envelopment Analysis (DEA), Bootstrap Data Envelopment Analysis (BDEA), IC packaging and testing.