Dr. Chong Leong, Gan

He has been a Quality and Reliability Member of Technical Staff with Altera Corporation, Product Engineering Manager with Osram Opto-Semiconductors, Senior R&D Engineering Manager with Western Digital since 2000, and currently working as Package Characterization Director with Micron Technology Inc.  He obtained B.S. degree in Chemistry from National University of Malaysia in 2000, M.S. degree in Chemical Instrumentation in 2003 from University Science Malaysia, and Ph.D. in Nanoelectronic Engineering from University Malaysia Perlis, Malaysia in 2015. He is a Fellow of Institute of Materials Malaysia, Fellow of Malaysian Institute of Chemistry and Associate Fellow of Asean Academy of Engineering and Technology. He has authored more than 60 peer reviewed papers in international referred journals and conference proceedings on various aspects of LED optoelectronics reliability, nanomaterials, materials chemistry, microelectronic packaging and reliability engineering. He is a semiconductor packaging expert with total 9 patents pending/ filing. His current research interests include advanced packaging technologies, electronic materials characterization, copper ball bond reliability, microelectronics reliability and nanomaterial engineering. He holds Member of IKM, IMM, Senior membership of IEEE and RACI CChem membership and also serving as journal reviewer of various international referred journals such as Journal of Materials Science: Materials in Electronics, Physica Solidi Status (B), IEEE Access, IEEE Transactions on Reliability, IEEE CPMT journal, IEEE TED, PlosOne, Journal of Materials Science, ASME Journal of Electronics Packaging, Journal of Materials Science: Materials in Electronics, Nano-and Micro Letters and Microelectronics International starting 2012. His H-index is 15 and with editorial board member of Springer’s Journal of Materials Science: Materials in Electronics, Emerald’s Soldering and Surface Mount Technology, Microelectronics International, Circuits World, World Journal of Engineering, IJQRM, Hindawi’s Journal of Engineering, Journal of Nanomaterials, Elsevier’s Life Cycle Reliability & Safety Engineering Journal and IEEE Access since 2013.